Material: FR4
Dielectric constant: 4.2
Outer copper foil thickness : 1oz
Surface Treatment: Immersion Gold
Minimum Wire Width: 0.3mm
Application: New Energy Products
Layer: 2 layers
Board Thickness: 1.6mm
Inner copper foil thickness: /
Minimum Hole Diameter: 0.3mm
Minimum wire pitch: 0.3mm
Features: Soldermask thickness over 25um, IPC level 3 standard
Item | Capability |
Base Material | FR-4 / High TG FR-4 / Halogen Free material/Rogers/Arlon/Taconic/Teflon |
Layers | 1-40 |
Finised inner/outer copper thickness | 1-6OZ |
Finished board thickness | 0.2-7.0mm |
Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
Controlled Impedance | +/-5% |
Plugging vias capability | 0.2-0.8mm |
Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
Surface treatment | HASL, HASL lead free, Immersion Gold, Immersion Tin, Immersion Silver, Hard gold, Flash gold, OSP… |
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