Board Material:Aluminum PCB
Copper Thickness:0.5-3OZ
Board Thickness:0.4-3mm
Min. Hole Size:0.2mm
Min. Line Width:0.1mm
Min. Line Spacing:0.1mm
Surface Finishing:HASL, HASL-Lead free, OSP, ENIG, Im-Cu,Im-Ag,Im-Sn
Board Size:580*900mm
Certificate:ROSH. ISO9001. UL. ISO14001
Application:LED Bulb Lighting
Silkscreen:White Black
Solder mask:Green. Red. Blue. White. Black.Yellow.Grew
Package:Vacuum Package
Board thickness:0.4-3mm
LED number:3030
PCBA service:SMD SMT DIP Component Assembly
PRODUCT CONFIGURATION
Aluminum PCB manufacture Capability
Materials | Aluminum ,copper | Copper Clad (outer) | 1/2 oz, 1 oz, 2 oz, 3 oz, 4 oz |
Maximum Lager Count | 4 Layers | Surface Finishes | ENTEK 106A, Immersion Gold, HAL, immersion silver |
Maximum Panel Size | 17″ x 23″ (432 x 584 mm2) | Solder Mask | LPI: Taiyo PSR 4000, Tamura DS2200, Probimer 77MA |
Min. Board Thickness | 1.0mm Al, 4 mils (0.1 mm) FR4 | Minimum Trace (width) | 12.0 mils (0.30 mm) |
Copper Clad (inner) | 1/2 oz, 1 oz, 2 oz, 3 oz, 4oz | Minimum Trace (spacing) | 12.0 mils (0.30 mm) |
Minimum PAD-TO-PAD TOL. | ± 3 mils (± 0.76 mm) | Hole Size Tolerance (PTH) | ± 3 mils (± 0.076 mm) |
Hole Size Tolerance (NPTH) | ± 2 mils (± 0.05 mm) | Minimum Hole Size | 20 mils (0.50 mm) |
Outline Dimensional Tol. | < ± 10 mils (0.25 mm) | Ionic Cleanliness | < 5 mg/in2 of NaCl (0.775 mg/cm2) |
Impedance Control | ± 10% (Differential) | Warpage | < 1% |
NO MOQ,1pcs also can be accepted.