Internet of vehicles, automated driving and electric vehicles and other trends in vogue, the long-term growth of demand for automotive PCB, including single and double-sided boards, multilayer boards, HDI and flexible boards, according to the Industrial Technology Research Institute estimates that by 2028, the automotive PCB usage will grow by 50% compared to 2022, which in turn to the single and double-sided boards for the bulk of the HDI / flexible boards in the ADAS, smart cockpit and battery flexible boards and other products Driven by the strongest growth.

Domestic PCB manufacturers to form two major supply camps, the traditional automotive PCB-based manufacturers in the automotive safety PCB still has a first-mover advantage, while emerging manufacturers will rely on faster solutions and adaptability, cut into the supply chain, superimposed on the downstream rise in demand for domestic local automotive brands are expected to take over the overseas supply of automotive PCB.

If the field of electric vehicles alone, because an electric car with PCB boards compared to traditional oil car usage is 1-2 times higher level, and it is estimated that by 2030, electric vehicles will become the main application of vehicle boards, the growth of electric vehicle boards will be even greater.

The technology development trend, ITRI believes that, in terms of HDI, in the automotive market will be towards the development of high order number or anylayer, or with mSAP process, the threshold is higher; and in the multilayer board products, it will be towards the design and development of thick copper, embedded copper block, metal substrate and other areas; and in the soft board products, in the application of the soft board instead of a heavier wiring harness, in order to reduce the weight of the car, but the soft board products will be towards the long design.

Overall, automotive electrification and intelligent wind is strong, will bring three aspects of the PCB industry

1, PCB heat dissipation and BMS management design demand increases

Global new energy vehicles to enter the accelerated penetration period, in the policy to promote the battery range to improve under the help of the bottlenecks that restrict the development of new energy vehicles gradually eliminated. New energy vehicles towards a highly integrated trend, the formation of a large three power integration (new energy vehicle electronic control, motor and reducer into one) and small three power integration (on-board charger, power drive unit, DC-DC converter integrated into the charging and distribution of power as a whole), the new energy vehicle 800V high-voltage platform will also become the mainstream programme. To solve the high-power heat dissipation is the mainstream trend of new energy vehicles PCB design, including thick copper or embedded copper programme, in the BMS with a soft board instead of a harness programme.

2, high multilayer HDI and high-frequency PCB programme increase

Under the trend of automotive intelligence, the electrical architecture to integrated evolution, will develop from distributed electronic and electrical architecture to (cross) domain centralised electronic and electrical architecture, and ultimately form a centralised electronic and electrical architecture of the vehicle; high-level automatic driving programme is expected to be popular, automatic driving-related legislation continues to improve, hardware + algorithmic technology continues to progress, the level of automatic driving has been moving towards L4; in-vehicle intelligent cabin will be a number of different operating systems and The in-vehicle intelligent cockpit integrates the functions of multiple different operating systems and safety levels, and satisfies multi-modal human-computer interaction such as touch control/intelligent voice/visual recognition/intelligent display, and solutions such as AR-HUD and electronic exterior mirrors have emerged. Under the demand of highly integrated and super computing performance of automotive electronics, the amount of HDI in automotive PCB solutions increases, applicable to in-vehicle entertainment systems, self-driving master control, in-vehicle servers and other core links, usually using high-speed materials, more than 10 layers of 3-step HDI design.ADAS high-frequency signal transmission to promote the increase in high-frequency PCB dosage, such as 77GHz millimeter-wave radar, high-frequency copper-clad laminate materials or mixed-pressure materials. Materials or mixed pressure materials.

3, automotive PCB market from the car sales cycle, domestic manufacturers are expected to reshape the competitive landscape

Traditional automotive PCB market has a low average unit price, product reliability and stability requirements, customer certification cycle is long. Under the trend of automotive electrification and intelligence, PCB programme presents diversification, from the traditional 4-6 layer multilayer board-based programme to HDI, metal heat sink substrate, thick copper substrate, built-in component boards and other PCB programme evolution, the PCB dosage of a single car and the technical difficulty of the rise in the growth rate of the automotive PCB market gradually get rid of the automotive sales cycle. Domestic is one of the largest auto consumers, localised supporting the increasingly strong demand for domestic PCB manufacturers to form a traditional veteran automotive PCB suppliers, newcomers to the automotive PCB supply vendors two supply camps. Domestic PCB manufacturers are expected to go through two stages of development, the first stage of the industry blossomed, new car-making forces terminal incubation of new suppliers, breaking the original closed supply system; the second stage of the industry standardisation programme to determine the core number of material into a whole, rising technical barriers, the industry after the reshuffle from the dispersal of concentration.