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【 Industry Focus 】 Japan's PCB production hit a 2-year low

Time:2023-06-30 Views:925

According to the statistics released by the JEOL Electronics Packaging Circuits Association (JPCA) on June 20, the output of Japanese printed circuit boards (PCBs; hard boards+soft boards+module baseplates) in April 2023 fell 19.8% from the same month last year to 790000 square meters, shrinking for the 15th consecutive month; The production decreased significantly by 24.7% to 45.189 billion yen, marking the sixth consecutive month of contraction, setting a record for the largest decline in about 10 years (since February 2013, a significant decrease of 31.1%), and the monthly production reached a new low in 2 years and 3 months (since January 2021, 42.365 billion yen). In terms of types, Japan's rigid PCB production in April decreased by 17.5% compared to the same month last year to 647000 square meters, marking the 14th consecutive month of contraction; The production decreased by 26.1% to 28.534 billion yen, marking the eighth consecutive month of contraction.

The production of flexible PCBs has significantly decreased by 22.4% to 99000 square meters, showing a decrease for the third time in four months; Production decreased by 19.4% to 1.988 billion yen, falling into contraction for the sixth consecutive month.

The production of Module Substrates has significantly decreased by 40.1% to 43000 square meters, showing a decline for the 11th consecutive month; Production decreased significantly by 22.5% to 14.667 billion yen, marking the first contraction in three months.

From January to April 2023, Japan's PCB production decreased by 14.2% compared to the same period last year to 3.33 million square meters, and the production decreased by 14.3% to 195.075 billion yen. Among them, the production of hard boards decreased by 12.5% to 2.745 million square meters, and the production volume decreased by 19.2% to 118.298 billion yen; The production of soft boards decreased by 10.6% to 426000 square meters, and the production volume decreased by 10.6% to 8.932 billion yen; The production of module substrates decreased significantly by 40.0% to 158000 square meters, and the production volume shrank by 4.8% to 67.845 billion yen.


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